ＣＯＢ: Chip On Board,Bare die direct attachment to PCB , Multiple chips can be bonded on the same board for compact system . Suitable for low to medium pin count IC (<200 pins).


COG : Chip On Glass ，Au bump slim die direct attachment to glass using ACF . Best fit for mobile communication products that require very small and thin LCD module .  Integrated features on chip to minimize external components. Suitable for high pin count IC (>200 pins) with fine pad pitch .


TAB : Tape Automated Bonding.TAB is the answer to the most pronounced packaging demand from contemporary electronic industry. With TAB, extremely light weight and compact products become possible. TAB is useful for high pin count devices, especially for LCD drivers. It offers excellent reliability, manufacturing ease and high throughput. Moreover, TAB can be directly connected to the LCD glass panel which enables tremendous size miniaturization